US Patent Application 18449061. COPOLYMER, MOLDED BODY, INJECTION MOLDED BODY, AND COATED ELECTRICAL WIRE simplified abstract

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COPOLYMER, MOLDED BODY, INJECTION MOLDED BODY, AND COATED ELECTRICAL WIRE

Organization Name

DAIKIN INDUSTRIES, LTD.

Inventor(s)

Tadaharu Isaka of Osaka (JP)

Yumi Zenke of Osaka (JP)

Yukari Yamamoto of Osaka (JP)

Hayato Tsuda of Osaka (JP)

Takashi Sekiguchi of Osaka (JP)

COPOLYMER, MOLDED BODY, INJECTION MOLDED BODY, AND COATED ELECTRICAL WIRE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18449061 titled 'COPOLYMER, MOLDED BODY, INJECTION MOLDED BODY, AND COATED ELECTRICAL WIRE

Simplified Explanation

The patent application describes a copolymer made up of tetrafluoroethylene and perfluoro(propyl vinyl ether) units.

  • The copolymer has a specific content of perfluoro(propyl vinyl ether) unit, ranging from 2.26 to 2.75 mol % of the total monomer units.
  • The copolymer has a specific melt flow rate at 372° C, ranging from 4.0 to 11.0 g/10 min.
  • The copolymer has a limited number of functional groups, with 50 or less per 10 main-chain carbon atoms.


Original Abstract Submitted

There is provided a copolymer containing tetrafluoroethylene unit and perfluoro(propyl vinyl ether) unit, wherein the copolymer has a content of perfluoro(propyl vinyl ether) unit of 2.26 to 2.75 mol % with respect to the whole of the monomer units, a melt flow rate at 372° C. of 4.0 to 11.0 g/10 min, and the number of functional groups of 50 or less per 10main-chain carbon atoms.