US Patent Application 18447502. MODIFIED FLUORORESIN MATERIAL, MATERIAL FOR CIRCUIT BOARD, LAMINATE FOR CIRCUIT BOARD, CIRCUIT BOARD, AND METHOD FOR PRODUCING MODIFIED FLUORORESIN MATERIAL simplified abstract

MODIFIED FLUORORESIN MATERIAL, MATERIAL FOR CIRCUIT BOARD, LAMINATE FOR CIRCUIT BOARD, CIRCUIT BOARD, AND METHOD FOR PRODUCING MODIFIED FLUORORESIN MATERIAL

Organization Name

DAIKIN INDUSTRIES, LTD.

Inventor(s)

Kyouhei Sawaki of Osaka (JP)

Shingo Okuno of Osaka (JP)

Yuki Ueda of Osaka (JP)

Ken Okanishi of Osaka (JP)

Toshiyuki Fukushima of Osaka (JP)

Hitoshi Imamura of Osaka (JP)

MODIFIED FLUORORESIN MATERIAL, MATERIAL FOR CIRCUIT BOARD, LAMINATE FOR CIRCUIT BOARD, CIRCUIT BOARD, AND METHOD FOR PRODUCING MODIFIED FLUORORESIN MATERIAL - A simplified explanation of the abstract

This abstract first appeared for US patent application 18447502 titled 'MODIFIED FLUORORESIN MATERIAL, MATERIAL FOR CIRCUIT BOARD, LAMINATE FOR CIRCUIT BOARD, CIRCUIT BOARD, AND METHOD FOR PRODUCING MODIFIED FLUORORESIN MATERIAL

Simplified Explanation

- The patent application describes a modified fluororesin material that has a lower linear expansion coefficient compared to a non-modified fluororesin material. - The modified fluororesin material contains a tetrafluoroethylene unit, a modifying monomer unit, and a tertiary carbon atom. - The tertiary carbon atom is present in a specific amount (0.001 to 0.030 mol %) in relation to the total amount of the tetrafluoroethylene unit and the modifying monomer unit. - The modified fluororesin material is suitable for use in circuit boards. - The patent application also discloses a laminate for a circuit board, a circuit board, and a method for producing the modified fluororesin material.

Original Abstract Submitted

A modified fluororesin material containing a modified fluororesin which contains a tetrafluoroethylene unit, a modifying monomer unit based on a modifying monomer copolymerizable with tetrafluoroethylene, and a tertiary carbon atom. The tertiary carbon atom is present in an amount of 0.001 to 0.030 mol % of a total amount of the tetrafluoroethylene unit and the modifying monomer unit. The modified fluororesin material has a linear expansion coefficient at 20° C. to 200° C. that is 10% or more lower than that of a non-modified fluororesin material. The non-modified fluororesin material contains a tetrafluoroethylene unit and a modifying monomer unit based on a modifying monomer copolymerizable with tetrafluoroethylene and containing no tertiary carbon atom. Also disclosed is a material for a circuit board including the modified fluororesin material, a laminate for a circuit board, a circuit board, and a method for producing the modified fluororesin material.