US Patent Application 18446746. COPOLYMER, MOLDED BODY, INJECTION MOLDED BODY, AND COATED ELECTRICAL WIRE simplified abstract

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COPOLYMER, MOLDED BODY, INJECTION MOLDED BODY, AND COATED ELECTRICAL WIRE

Organization Name

DAIKIN INDUSTRIES, LTD.

Inventor(s)

Tadaharu Isaka of Oaaka (JP)

Yumi Zenke of Osaka (JP)

Yukari Yamamoto of Osaka (JP)

Hayato Tsuda of Osaka (JP)

Hiroyuki Hamada of Osaka (JP)

COPOLYMER, MOLDED BODY, INJECTION MOLDED BODY, AND COATED ELECTRICAL WIRE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18446746 titled 'COPOLYMER, MOLDED BODY, INJECTION MOLDED BODY, AND COATED ELECTRICAL WIRE

Simplified Explanation

The patent application describes a copolymer made up of tetrafluoroethylene and perfluoro(propyl vinyl ether) units.

  • The copolymer contains 3.3 to 4.2% perfluoro(propyl vinyl ether) units by mass.
  • The copolymer has a melt flow rate of 27.0 to 35.0 g/10 min at 372°C.
  • The copolymer has 20 or fewer functional groups per 10 main-chain carbon atoms.


Original Abstract Submitted

There is provided a copolymer containing tetrafluoroethylene unit and perfluoro(propyl vinyl ether) unit, wherein the copolymer has a content of perfluoro(propyl vinyl ether) unit of 3.3 to 4.2% by mass with respect to the whole of the monomer units, the melt flow rate at 372° C. of 27.0 to 35.0 g/10 min, and the number of functional groups of 20 or less per 10main-chain carbon atoms.