US Patent Application 18446740. WIRE-BOND DAMPER FOR SHOCK ABSORPTION simplified abstract

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WIRE-BOND DAMPER FOR SHOCK ABSORPTION

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.


Inventor(s)

Tsung-Lin Hsieh of Hsinchu City (TW)

Wei-Jhih Mao of Taipei City (TW)

Shang-Ying Tsai of Pingzhen City (TW)

Kuei-Sung Chang of Kaohsiung City (TW)

Chun-Wen Cheng of Zhubei City (TW)

WIRE-BOND DAMPER FOR SHOCK ABSORPTION - A simplified explanation of the abstract

This abstract first appeared for US patent application 18446740 titled 'WIRE-BOND DAMPER FOR SHOCK ABSORPTION

Simplified Explanation

The patent application is for a microelectromechanical systems (MEMS) package that includes a wire-bond damper.

  • The MEMS package consists of a housing structure, a support substrate, and a MEMS structure.
  • The MEMS structure includes an anchor, a spring, and a movable mass.
  • The spring connects the anchor to the movable mass, allowing for movement of the mass within a cavity.
  • The wire-bond damper is located on the movable mass or the structure surrounding it.
  • The wire-bond damper can be on the top surface of the movable mass or on the support substrate between the anchor and the movable mass.
  • The wire-bond damper is made of a wire formed by wire bonding and is designed to dampen shock to the movable mass.


Original Abstract Submitted

Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) package comprising a wire-bond damper. A housing structure overlies a support substrate, and a MEMS structure is between the support substrate and the housing structure. The MEMS structure comprises an anchor, a spring, and a movable mass. The spring extends from the anchor to the movable mass to suspend and allow movement of the movable mass in a cavity between the support substrate and the housing structure. The wire-bond damper is on the movable mass or structure surrounding the movable mass. For example, the wire-bond damper may be on a top surface of the movable mass. As another example, the wire-bond damper may be on the support substrate, laterally between the anchor and the movable mass. Further, the wire-bond damper comprises a wire formed by wire bonding and configured to dampen shock to the movable mass.


Category:B81B7/00 Category:B81C1/00

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