US Patent Application 18446392. STRUCTURES AND METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE simplified abstract
Contents
STRUCTURES AND METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Sheng-Yuan Lin of Hsinchu (TW)
STRUCTURES AND METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18446392 titled 'STRUCTURES AND METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE
Simplified Explanation
The present disclosure is about exclusion rings used in processing semiconductor substrates in a processing chamber, specifically a chemical vapor deposition chamber.
- The exclusion ring has an alignment structure that works with an alignment structure on a platen where the exclusion ring will be placed during wafer processing.
- The first alignment structure has a guiding surface that helps position the second alignment structure within it.
- The exclusion rings described in the patent application improve the processing of semiconductor substrates in a chemical vapor deposition chamber.
- The alignment structures on the exclusion ring and platen ensure accurate positioning of the exclusion ring during wafer processing.
- The guiding surface on the first alignment structure aids in the reception and positioning of the second alignment structure.
- The patent application also includes methods for using these exclusion rings in semiconductor substrate processing.
Original Abstract Submitted
The present disclosure relates to exclusion rings for use in processing a semiconductor substrate in a processing chamber, such as a chemical vapor deposition chamber. The exclusion ring includes an alignment structure that cooperates with an alignment structure on a platen on which the exclusion ring will rest during processing of the wafer. The first alignment structure includes a guiding surface which promotes the reception of and positioning of the second alignment structure within the first alignment structure. Methods of utilizing the described exclusion rings are also described.
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yi Shen of Hsinchu (TW)
- Hsin-Lin Wu of Hsinchu (TW)
- Yao-Fong Dai of Hsinchu (TW)
- Pei-Yuan Tai of Hsinchu (TW)
- Chin-Wei Chen of Hsinchu (TW)
- Yin-Tun Chou of Hsinchu (TW)
- Yuan-Hsin Chi of Hsinchu (TW)
- Sheng-Yuan Lin of Hsinchu (TW)
- C23C14/56
- H01L21/687
- C23C16/455
- C23C14/50