US Patent Application 18446014. MULTI-TIM PACKAGES AND METHOD FORMING SAME simplified abstract
Contents
MULTI-TIM PACKAGES AND METHOD FORMING SAME
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Ping-Yin Hsieh of Hsinchu (TW)
Li-Hui Cheng of New Taipei City (TW)
MULTI-TIM PACKAGES AND METHOD FORMING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18446014 titled 'MULTI-TIM PACKAGES AND METHOD FORMING SAME
Simplified Explanation
The patent application describes a method for packaging electronic components with thermal interface materials and a heat sink.
- The method involves placing a package that contains two components and an encapsulant that surrounds them.
- A first thermal interface material is attached to the first component, and a second thermal interface material, different from the first, is attached to the second component.
- Finally, a heat sink is attached over both thermal interface materials to dissipate heat.
Original Abstract Submitted
A method includes placing a package, which includes a first package component, a second package component, and an encapsulant encapsulating the first package component and the second package component therein. The method further includes attaching a first thermal interface material over the first package component, attaching a second thermal interface material different from the first thermal interface material over the second package component, and attaching a heat sink over both of the first thermal interface material and the second thermal interface material.
