US Patent Application 18446006. Semiconductor Device and Method of Manufacture simplified abstract
Contents
Semiconductor Device and Method of Manufacture
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Jiun Yi Wu of Zhongli City (TW)
Semiconductor Device and Method of Manufacture - A simplified explanation of the abstract
This abstract first appeared for US patent application 18446006 titled 'Semiconductor Device and Method of Manufacture
Simplified Explanation
The patent application describes a package design for electronic devices.
- The package includes multiple layers of molding material and metallization layers.
- Through vias are present within the molding material, connecting the metallization layers.
- Integrated passive devices are embedded within the molding material.
- A redistribution structure is present on top of the metallization layer and molding material.
- The redistribution structure is connected to the through vias and integrated passive devices.
- At least one semiconductor device is mounted on the redistribution structure and connected to it.
Original Abstract Submitted
A package includes a first layer of molding material, a first metallization layer on the first layer of molding material, a second layer of molding material on the first metallization layer and the first layer of molding material, a second metallization layer on the second layer of molding material, through vias within the second layer of molding material, the through vias extending from the first metallization layer to the second metallization layer, integrated passive devices within the second layer of molding material, a redistribution structure electrically on the second metallization layer and the second layer of molding material, the redistribution structure connected to the through vias and the integrated passive devices, and at least one semiconductor device on the redistribution structure, the at least one semiconductor device connected to the redistribution structure.
