US Patent Application 18366753. Cured Epoxy Resin Composition Suitable for Electronic Device Enclosure, Articles, and Methods simplified abstract

Cured Epoxy Resin Composition Suitable for Electronic Device Enclosure, Articles, and Methods

Organization Name

3M INNOVATIVE PROPERTIES COMPANY

Inventor(s)

Brett A. Beiermann of St. Paul MN (US)

John C. Clark of Maplewood MN (US)

Eric G. Larson of Lake Elmo MN (US)

Jeremy M. Higgins of Roseville MN (US)

Audrey S. Forticaux of Minneapolis MN (US)

Jay R. Lomeda of St. Paul MN (US)

Wayne S. Mahoney of St. Paul MN (US)

Scott B. Charles of Spring Valley WI (US)

Timothy D. Fletcher of Lino Lakes MN (US)

Wendy L. Thompson of Roseville MN (US)

Kyle R. Schwartz of Maplewood MN (US)

Cured Epoxy Resin Composition Suitable for Electronic Device Enclosure, Articles, and Methods - A simplified explanation of the abstract

This abstract first appeared for US patent application 18366753 titled 'Cured Epoxy Resin Composition Suitable for Electronic Device Enclosure, Articles, and Methods

Simplified Explanation

The abstract describes an electronic device with an enclosure made of a cured epoxy resin composition containing electrically non-conductive but thermally conductive inorganic particles. The enclosure can be used for phones, laptops, mice, or as a case for other electronic devices. The abstract also mentions the epoxy resin compositions and a method for making the enclosure.

• The electronic device has an enclosure made of a cured epoxy resin composition.
• The enclosure contains at least 50% of electrically non-conductive but thermally conductive inorganic particles.
• The enclosure can be used as a housing for phones, laptops, or mice.
• Alternatively, the enclosure can be used as a case for other electronic devices.
• The epoxy resin compositions are described in the patent application.
• The patent application also includes a method for making the enclosure for an electronic device.

Original Abstract Submitted

An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.