US Patent Application 18365420. SEMICONDUCTOR DEVICE AND METHOD simplified abstract

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SEMICONDUCTOR DEVICE AND METHOD

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Shiang-Bau Wang of Pingzchen City (TW)

Li-Wei Yin of Hsinchu (TW)

Chen-Huang Huang of Hsinchu (TW)

Ming-Jhe Sie of Taipei (TW)

Ryan Chia-Jen Chen of Hsinchu (TW)

SEMICONDUCTOR DEVICE AND METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18365420 titled 'SEMICONDUCTOR DEVICE AND METHOD

Simplified Explanation

The patent application describes a device with a specific structure and configuration. Here is a simplified explanation of the abstract:

  • The device includes a fin that extends from a substrate.
  • A gate stack is placed on the fin, which controls the flow of current in the device.
  • A source/drain region is located in the fin, allowing for the input and output of current.
  • A contact etch stop layer (CESL) is positioned over the source/drain region, providing protection.
  • A gate spacer runs along the side of the gate stack, further enhancing the device's functionality.
  • A dielectric plug is placed between the CESL and the gate spacer, creating a void that physically separates the gate stack from the source/drain region.
  • This configuration helps improve the performance and reliability of the device.


Original Abstract Submitted

In an embodiment, a device includes: a first fin extending from a substrate; a gate stack disposed on the first fin; a source/drain region disposed in the first fin; a contact etch stop layer (CESL) disposed over the source/drain region; a gate spacer extending along a side of the gate stack; and a dielectric plug disposed between the CESL and the gate spacer, where the dielectric plug, the CESL, the gate spacer, and the source/drain region collectively define a void physically separating the gate stack from the source/drain region.