US Patent Application 18362135. SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION simplified abstract

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Shao-Hua Wang of Taoyuan City (TW)

Kueilin Ho of Hsinchu (TW)

Cheng Wei Sun of Hsinchu (TW)

Zong-You Yang of Hsinchu (TW)

Chih-Chun Chiang of Miaoli (TW)

Yi-Fam Shiu of Toufen City (TW)

Chueh-Chi Kuo of Kaohsiung City (TW)

Heng-Hsin Liu of New Taipei City (TW)

Li-Jui Chen of Hsinchu City (TW)

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 18362135 titled 'SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

Simplified Explanation

- The patent application describes a method for reducing particle generation in a lithography system. - The method involves operating components in the system at variable speeds. - By operating a component at a high movement speed through one portion of an actuation operation and then reducing the movement speed through another portion, particle generation can be minimized. - The reduced movement speed during the interaction of contact parts of the component reduces the likelihood of particle generation. - The high movement speed allows for a high throughput of semiconductor substrates in the system.

Original Abstract Submitted

Some implementations described herein include operating components in a lithography system at variable speeds to reduce, minimize, and/or prevent particle generation due to rubbing of or collision between contact parts of the components. In some implementations, a component in a path of transfer of a semiconductor substrate in the lithography system is operated at a relatively high movement speed through a first portion of an actuation operation, and is operated at a reduced movement speed (e.g., a movement speed that is less than the high movement speed) through a second portion of the actuation operation in which contact parts of the component are to interact. The reduced movement speed reduces the likelihood of particle generation and/or release from the contact parts when the contact parts interact, while the high movement speed provides a high semiconductor substrate throughput in the lithography system.