US Patent Application 18361933. METALLIZATION STRUCTURE simplified abstract
Contents
METALLIZATION STRUCTURE
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Ming-Chih Yew of Hsinchu City (TW)
Shu-Shen Yeh of Taoyuan City (TW)
Po-Yao Lin of Hsinchu County (TW)
METALLIZATION STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18361933 titled 'METALLIZATION STRUCTURE
Simplified Explanation
The patent application describes a metallization structure that is connected to a conductive bump.
- The metallization structure includes an oblong-shaped or elliptical-shaped redistribution pad, a conductive via on the redistribution pad, and an under bump metallurgy covering the conductive via.
- The conductive bump is placed on the under bump metallurgy.
- The patent also mentions a package structure that includes these metallization structures.
Original Abstract Submitted
A metallization structure electrically connected to a conductive bump is provided. The metallization structure includes an oblong-shaped or elliptical-shaped redistribution pad, a conductive via disposed on the oblong-shaped or elliptical-shaped redistribution pad, and an under bump metallurgy covering the conductive via, wherein the conductive bump is disposed on the UBM. Furthermore, a package structure including the above-mentioned metallization structures is provided.
