US Patent Application 18359891. METHOD OF MANUFACTURING ELECTRONIC DEVICE simplified abstract
Contents
METHOD OF MANUFACTURING ELECTRONIC DEVICE
Organization Name
Inventor(s)
Jia-Yuan Chen of Miao-Li County (TW)
Tsung-Han Tsai of Miao-Li County (TW)
Kuan-Feng Lee of Miao-Li County (TW)
METHOD OF MANUFACTURING ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18359891 titled 'METHOD OF MANUFACTURING ELECTRONIC DEVICE
Simplified Explanation
The patent application describes a method of manufacturing an electronic device. Here are the key points:
- The method starts with providing a substrate with a first surface, a second surface, and a side surface.
- A first circuit is formed on the first surface, which includes a transistor and several pads.
- The pads consist of a first bonding pad, a second bonding pad, a first conductive pad, and a first passivation layer.
- The first passivation layer is placed on top of the transistor, and the pads are placed on top of the passivation layer.
- A first protection layer is then formed on either the first surface or the second surface of the substrate.
- A first cutting lane is created on the substrate.
Overall, this method outlines the steps involved in manufacturing an electronic device, including the formation of circuits, pads, passivation layers, protection layers, and cutting lanes.
Original Abstract Submitted
A method of manufacturing an electronic device includes the following steps. A substrate is provided, and the substrate has a first surface, a second surface opposite to the first surface and a side surface between the first surface and the second surface. A first circuit is formed on the first surface. The first circuit includes a transistor, a plurality of pads which comprises a first bonding pad, a second bonding pad, a first conductive pad and a first passivation layer. The first passivation layer is disposed on the transistor. The first bonding pad, the second bonding pad and the first conductive pad are respectively disposed on the first passivation layer. A first protection layer is formed on one of the first surface and the second surface. A first cutting lane is formed on the substrate.
