US Patent Application 18359864. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract

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SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.==Inventor(s)==

[[Category:Ting-Yu Yeh of Hsinchu (TW)]]

[[Category:Cing-He Chen of Taoyuan City (TW)]]

[[Category:Kuo-Chiang Ting of Hsinchu City (TW)]]

[[Category:Weiming Chris Chen of Taipei City (TW)]]

[[Category:Chia-Hao Hsu of Hsinchu (TW)]]

[[Category:Kuan-Yu Huang of Taipei (TW)]]

[[Category:Shu-Chia Hsu of Hsinchu (TW)]]

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 18359864 titled 'SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Simplified Explanation

The patent application describes a semiconductor structure with a solder resist layer on a circuit substrate, partially covering contact pads.

  • The structure includes external terminals on the solder resist layer, which extend through the layer to connect with the contact pads.
  • The external terminals have different heights, with the first terminal being shorter than the second terminal.
  • The interface between the first terminal and its corresponding contact pad is smaller than the interface between the second terminal and its corresponding contact pad.


Original Abstract Submitted

A semiconductor structure includes a solder resist layer disposed on a circuit substrate and partially covering contact pads of the circuit substrate, and external terminals disposed on the solder resist layer and extending through the solder resist layer to land on the contact pads. The external terminals include a first external terminal and a second external terminal which have different heights. A first interface between the first external terminal and corresponding one of the contact pads underlying the first external terminal is less than a second interface between the second external terminal and another corresponding one of the contact pads underlying the second external terminal.

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