US Patent Application 18359364. Semiconductor Device Cleaning Solution, Method of Use, and Method of Manufacture simplified abstract
Semiconductor Device Cleaning Solution, Method of Use, and Method of Manufacture
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Pinlei Edmund Chu of Hsinchu (TW)
Ling-Fu Nieh of Taipei City (TW)
Chi-Jen Liu of Taipei City (TW)
Liang-Guang Chen of Hsinchu (TW)
Yi-Sheng Lin of Taichung City (TW)
Semiconductor Device Cleaning Solution, Method of Use, and Method of Manufacture - A simplified explanation of the abstract
This abstract first appeared for US patent application 18359364 titled 'Semiconductor Device Cleaning Solution, Method of Use, and Method of Manufacture
Simplified Explanation
The abstract describes a semiconductor cleaning solution and its method of use and manufacture.
- The cleaning solution is designed to clean the surface of a semiconductor device.
- It involves polishing away a material from the surface and then using the cleaning solution.
- The cleaning solution contains a host with at least one ring.
- The host has a hydrophilic (water-attracting) exterior and a hydrophobic (water-repelling) interior.
Original Abstract Submitted
A semiconductor cleaning solution for cleaning a surface of a semiconductor device, and a method of use and a method of manufacture of the cleaning solution are disclosed. In an embodiment, a material is polished away from a first surface of the semiconductor device and the first surface is cleaned with the cleaning solution. The cleaning solution may include a host having at least one ring. The host may have a hydrophilic exterior and a hydrophobic interior.
