US Patent Application 18359180. Novel CMP Pad Design and Method of Using the Same simplified abstract
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Contents
Novel CMP Pad Design and Method of Using the Same
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Hui-Chi Huang of Zhubei City (TW)
Kei-Wei Chen of Tainan City (TW)
Novel CMP Pad Design and Method of Using the Same - A simplified explanation of the abstract
This abstract first appeared for US patent application 18359180 titled 'Novel CMP Pad Design and Method of Using the Same
Simplified Explanation
The patent application describes a polishing pad consisting of a top pad and a sub pad.
- The top pad has grooves on its surface and microchannels that connect these grooves to the bottom surface of the pad.
- The sub pad also has grooves on its surface.
- The purpose of this invention is to improve the polishing process by providing a pad with enhanced surface features.
- The grooves and microchannels help distribute polishing agents evenly and efficiently.
- The sub pad adds an additional layer of functionality to the polishing process.
- This innovation aims to enhance the overall performance and effectiveness of polishing pads.
Original Abstract Submitted
An embodiment is a polishing pad including a top pad and a sub pad that is below and contacting the top pad. The top pad includes top grooves along a top surface and microchannels extending from the top grooves to a bottom surface of the top pad. The sub pad includes sub grooves along a top surface of the sub pad.
