US Patent Application 18358684. MECHANISM TO SHIFT THE HEAD SPAN OF A TAPE HEAD AT A WAFER LEVEL simplified abstract

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MECHANISM TO SHIFT THE HEAD SPAN OF A TAPE HEAD AT A WAFER LEVEL

Organization Name

International Business Machines Corporation

Inventor(s)

Icko E.T. Iben of Santa Clara CA (US)

Jason Liang of Campbell CA (US)

Hoodin Hamidi of San Francisco CA (US)

MECHANISM TO SHIFT THE HEAD SPAN OF A TAPE HEAD AT A WAFER LEVEL - A simplified explanation of the abstract

This abstract first appeared for US patent application 18358684 titled 'MECHANISM TO SHIFT THE HEAD SPAN OF A TAPE HEAD AT A WAFER LEVEL

Simplified Explanation

The abstract describes a magnetic tape head, a magnetic tape drive, and a computational device.

  • The magnetic tape head consists of multiple elements.
  • The pitch (spacing) between adjacent elements is not the same.
  • The invention is not specified further in the abstract.


Original Abstract Submitted

Provided are a magnetic tape head, a magnetic tape drive, and a computational device in which the magnetic tape head is comprised of a plurality of elements, wherein a pitch between adjacent elements of the plurality of elements is not identical.

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