US Patent Application 18357757. Package Substrate Insulation Opening Design simplified abstract
Contents
Package Substrate Insulation Opening Design
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Shu-Jung Tseng of Wuci Township (TW)
Package Substrate Insulation Opening Design - A simplified explanation of the abstract
This abstract first appeared for US patent application 18357757 titled 'Package Substrate Insulation Opening Design
Simplified Explanation
The patent application describes a semiconductor package design.
- The package includes a substrate and multiple layers of dielectric material.
- There are two bond pads on the first dielectric layer, with one pad facing the other.
- The second dielectric layer covers the bond pads, but there is an opening that exposes the first bond pad.
- The opening has a specific shape in a top view, exposing a segment of the first bond pad's sidewall.
- The exposed segment is located between two other segments of the sidewall, with one segment covered by the second dielectric layer.
Original Abstract Submitted
A semiconductor package includes: a substrate; a first dielectric layer over the substrate; a first bond pad and a second bond pad over the first dielectric layer, the first bond pad having a first sidewall facing the second bond pad; a second dielectric layer over the first and the second bond pads; and an opening through the second dielectric layer and extending from the first bond pad to the second bond pad, the opening including a first area over and exposing the first bond pad, where in a top view, the opening exposes a first segment of the first sidewall disposed between a first edge and a second edge of the first area that intersect the first sidewall, where the first segment of the first sidewall is between a second segment and a third segment of the first sidewall, the second segment being covered by the second dielectric layer.
