US Patent Application 18357137. STACKING STRUCTURE, PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME simplified abstract
Contents
STACKING STRUCTURE, PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Ming-Fa Chen of Taichung City (TW)
Sung-Feng Yeh of Taipei City (TW)
Tzuan-Horng Liu of Taoyuan City (TW)
Chao-Wen Shih of Hsinchu County (TW)
STACKING STRUCTURE, PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18357137 titled 'STACKING STRUCTURE, PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
Simplified Explanation
The abstract describes a package structure that includes multiple stacked die units and an insulating encapsulant. Each stacked die unit consists of a semiconductor die and a bonding chip. The semiconductor die has bonding pads, while the bonding chip has bonding structures. The bonding structures are connected to the bonding pads using hybrid bonding. The stacked die units are then encapsulated with an insulating material.
- Package structure with stacked die units and insulating encapsulant
- Stacked die units consist of semiconductor die and bonding chip
- Semiconductor die has bonding pads
- Bonding chip has bonding structures
- Bonding structures are connected to bonding pads using hybrid bonding
- Stacked die units are encapsulated with insulating material
Original Abstract Submitted
A package structure includes a plurality of stacked die units and an insulating encapsulant. The plurality of stacked die units is stacked on top of one another, where each of the plurality of stacked die units include a first semiconductor die, a first bonding chip. The first semiconductor die has a plurality of first bonding pads. The first bonding chip is stacked on the first semiconductor die and has a plurality of first bonding structure. The plurality of first bonding structures is bonded to the plurality of first bonding pads through hybrid bonding. The insulating encapsulant is encapsulating the plurality of stacked die units.
