US Patent Application 18356227. METHOD OF FABRICATING PACKAGE STRUCTURE simplified abstract
Contents
METHOD OF FABRICATING PACKAGE STRUCTURE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chih-Hao Chen of Taipei City (TW)
Chin-Fu Kao of Taipei City (TW)
Li-Hui Cheng of New Taipei City (TW)
Szu-Wei Lu of Hsinchu City (TW)
METHOD OF FABRICATING PACKAGE STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18356227 titled 'METHOD OF FABRICATING PACKAGE STRUCTURE
Simplified Explanation
The patent application describes a structure that includes several components: a circuit substrate, a device, a metal layer, a lid, and a thermal interface material layer.
- The device is placed on the circuit substrate and is electrically connected to it.
- The device consists of at least one semiconductor die that is surrounded by an insulating encapsulation.
- A metal layer covers the back surface of the semiconductor die and the insulating encapsulation.
- A lid is positioned on the circuit substrate and is attached to the metal layer through a thermal interface material layer.
Original Abstract Submitted
A structure includes a circuit substrate, a device, a metal layer, a lid and a thermal interface material layer. The device is disposed on and electrically connected to the circuit substrate. The device includes at least one semiconductor die laterally encapsulated by an insulating encapsulation. The metal layer is covering a back surface of the at least one semiconductor die and the insulating encapsulation. The lid is disposed on the circuit substrate, and the lid is adhered to the metal layer through the thermal interface material layer.
