US Patent Application 18356224. PACKAGE HAVING DIFFERENT METAL DENSITIES IN DIFFERENT REGIONS AND MANUFACTURING METHOD THEREOF simplified abstract

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PACKAGE HAVING DIFFERENT METAL DENSITIES IN DIFFERENT REGIONS AND MANUFACTURING METHOD THEREOF

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.


Inventor(s)

Hsien-Wei Chen of Hsinchu City (TW)

Jie Chen of New Taipei City (TW)

Ming-Fa Chen of Taichung City (TW)

Sen-Bor Jan of Tainan City (TW)

PACKAGE HAVING DIFFERENT METAL DENSITIES IN DIFFERENT REGIONS AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 18356224 titled 'PACKAGE HAVING DIFFERENT METAL DENSITIES IN DIFFERENT REGIONS AND MANUFACTURING METHOD THEREOF

Simplified Explanation

The abstract describes a package that consists of two regions, with one region encircling the other. The package includes two dies, an encapsulant, and an inductor.

  • The first die is located in both regions, while the second die is bonded to the first die and is completely located within the first region.
  • The encapsulant surrounds the second die and is present in both regions.
  • The inductor is located entirely within the second region.
  • The first region has a higher metal density compared to the second region.


Original Abstract Submitted

A package has a first region and a second region encircled by the first region. The package includes a first die, a second die, an encapsulant, and an inductor. The first die is located in both the first region and the second region. The second die is bonded to the first die and is completely located within the first region. The encapsulant laterally encapsulates the second die. The encapsulant is located in both the first region and the second region. The inductor is completely located within the second region. A metal density in the first region is greater than a metal density in the second region.

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