US Patent Application 18356212. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
Contents
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Sheng-Chieh Yang of Hsinchu (TW)
Shing-Chao Chen of Hsinchu County (TW)
Ching-Hua Hsieh of Hsinchu (TW)
Chih-Wei Lin of Hsinchu County (TW)
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18356212 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The patent application describes a semiconductor package that includes a semiconductor device, an encapsulating material, and a redistribution structure.
- The semiconductor device has conductive bumps and a dielectric film encapsulating them.
- The dielectric film is made of an epoxy resin and a filler material.
- The dielectric film isolates the conductive bumps from the encapsulating material.
- The redistribution structure is connected to the conductive bumps.
Original Abstract Submitted
A semiconductor package includes a semiconductor device, an encapsulating material encapsulating the semiconductor device, and a redistribution structure disposed over the encapsulating material and the semiconductor device. The semiconductor device includes conductive bumps and a dielectric film encapsulating the conductive bumps, where a material of the dielectric film comprises an epoxy resin and a filler. The conductive bumps are isolated from the encapsulating material by the dielectric film. The redistribution structure is electrically connected to the conductive bumps.