US Patent Application 18355524. HYBRID BOND PAD STRUCTURE simplified abstract

HYBRID BOND PAD STRUCTURE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Sin-Yao Huang of Tainan City (TW)

Chun-Chieh Chuang of Tainan City (TW)

Ching-Chun Wang of Tainan (TW)

Sheng-Chau Chen of Tainan City (TW)

Dun-Nian Yaung of Taipei City (TW)

Feng-Chi Hung of Chu-Bei City (TW)

Yung-Lung Lin of Taichung City (TW)

HYBRID BOND PAD STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18355524 titled 'HYBRID BOND PAD STRUCTURE

Simplified Explanation

The patent application is about an integrated chip structure that includes two tiers of integrated chips.

• The first tier of the integrated chip is connected to the second tier through a bonding interface.
• The second tier has a second insulating structure and a second plurality of conductors.
• A conductive pad is connected to the second plurality of conductors and has a conductive surface.
• The conductive surface is located on the side of the second semiconductor body facing away from the first semiconductor body.
• The bonding interface includes conductive and insulating regions.
• The conductive regions are located outside of the bottom surface of the conductive pad.

Original Abstract Submitted

In some embodiments, the present disclosure relates to an integrated chip structure. The integrated chip structure includes a first integrated chip (IC) tier and a second IC tier. The second IC tier comprises a second plurality of conductors within a second insulating structure disposed on the second semiconductor body. A conductive pad is electrically coupled to the second plurality of conductors and has a conductive surface available to a side of the second semiconductor body facing away from the first semiconductor body. The IC first tier contacts the second IC tier along a bonding interface including one or more conductive regions and one or more insulating regions. The one or more conductive regions laterally outside of a bottom surface of the conductive pad.