US Patent Application 18354668. METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE simplified abstract

From WikiPatents
Jump to navigation Jump to search

METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.


Inventor(s)

Chia-Kuei Hsu of Hsinchu (TW)

Ming-Chih Yew of Hsinchu City (TW)

Po-Hao Tsai of Taoyuan City (TW)

Po-Yao Lin of Hsinchu County (TW)

Shin-Puu Jeng of Hsinchu (TW)

METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18354668 titled 'METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE

Simplified Explanation

The patent application describes a redistribution structure that includes multiple layers of dielectric material and a pad pattern.

  • The structure consists of a first dielectric layer, a pad pattern, and a second dielectric layer.
  • The pad pattern is placed on top of the first dielectric layer and consists of a pad portion and a peripheral portion.
  • The pad portion is embedded within the first dielectric layer, with its lower surface being at the same level as the lower surface of the first dielectric layer.
  • The peripheral portion surrounds the pad portion.
  • The second dielectric layer is then placed on top of the pad pattern.
  • The second dielectric layer includes extending portions that go through the peripheral portion of the pad pattern.
  • The extending portions provide additional connectivity and routing options within the redistribution structure.


Original Abstract Submitted

A redistribution structure includes a first dielectric layer, a pad pattern, and a second dielectric layer. The pad pattern is disposed on the first dielectric layer and includes a pad portion and a peripheral portion. The pad portion is embedded in the first dielectric layer, wherein a lower surface of the pad portion is substantially coplanar with a lower surface of the first dielectric layer. The peripheral portion surrounds the pad portion. The second dielectric layer is disposed on the pad pattern and includes a plurality of extending portions extending through the peripheral portion.

Retrieved from "http://wikipatents.org/index.php?title=US_Patent_Application_18354668._METHOD_FOR_FABRICATING_SEMICONDUCTOR_PACKAGE_simplified_abstract&oldid=6746"