US Patent Application 18354662. PACKAGE, OPTICAL DEVICE, AND MANUFACTURING METHOD OF PACKAGE simplified abstract

From WikiPatents
Jump to navigation Jump to search

PACKAGE, OPTICAL DEVICE, AND MANUFACTURING METHOD OF PACKAGE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.


Inventor(s)

Hsien-Wei Chen of Hsinchu City (TW)

Ming-Fa Chen of Taichung City (TW)

PACKAGE, OPTICAL DEVICE, AND MANUFACTURING METHOD OF PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18354662 titled 'PACKAGE, OPTICAL DEVICE, AND MANUFACTURING METHOD OF PACKAGE

Simplified Explanation

The patent application describes a package that includes a photonic integrated circuit die and an electric integrated circuit die.

  • The photonic integrated circuit die consists of a substrate and a waveguide.
  • The substrate has a notch that is filled with air.
  • The waveguide is placed over the substrate, with a portion overlapping the substrate and another portion overlapping the notch.
  • The electric integrated circuit die is positioned on top of the photonic integrated circuit die.


Original Abstract Submitted

A package includes a photonic integrated circuit die and an electric integrated circuit die. The photonic integrated circuit die includes a substrate and a waveguide. The substrate has a notch and the notch is occupied by air. The waveguide is disposed over the substrate. In a top view, a first portion of the waveguide is overlapped with the substrate and a second portion of the waveguide is overlapped with the notch. The electric integrated circuit die is disposed over the photonic integrated circuit die.

Retrieved from "http://wikipatents.org/index.php?title=US_Patent_Application_18354662._PACKAGE,_OPTICAL_DEVICE,_AND_MANUFACTURING_METHOD_OF_PACKAGE_simplified_abstract&oldid=6707"