US Patent Application 18354614. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chih-Hua Chen of Hsinchu County (TW)
Hao-Yi Tsai of Hsinchu City (TW)
Lipu Kris Chuang of Hsinchu City (TW)
Tin-Hao Kuo of Hsinchu City (TW)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18354614 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The patent application describes a semiconductor package with a redistribution structure, semiconductor devices, a heat dissipation component, and an encapsulating material.
- The semiconductor devices are placed on and connected to the redistribution structure.
- The heat dissipation component has a concave portion that receives the semiconductor devices and an extending portion that contacts the redistribution structure.
- The concave portion of the heat dissipation component directly contacts the semiconductor devices.
- The encapsulating material covers the redistribution structure, fills the concave portion, and encapsulates the semiconductor devices.
Original Abstract Submitted
A semiconductor package includes a redistribution structure, at least one semiconductor device, a heat dissipation component, and an encapsulating material. The at least one semiconductor device is disposed on and electrically connected to the redistribution structure. The heat dissipation component is disposed on the redistribution structure and includes a concave portion for receiving the at least one semiconductor device and an extending portion connected to the concave portion and contacting the redistribution structure, wherein the concave portion contacts the at least one semiconductor device. The encapsulating material is disposed over the redistribution structure, wherein the encapsulating material fills the concave portion and encapsulates the at least one semiconductor device.
