US Patent Application 18352727. PHOTONIC DEVICE simplified abstract

PHOTONIC DEVICE

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Sui-Ying Hsu of New Taipei City (TW)

Yueh-Ying Lee of Hsinchu City (TW)

Chien-Ying Wu of Hsinchu City (TW)

Chen-Hao Huang of Taoyuan City (TW)

Chien-Chang Lee of Miaoli County (TW)

Chia-Ping Lai of Hsinchu City (TW)

PHOTONIC DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18352727 titled 'PHOTONIC DEVICE

Simplified Explanation

The patent application describes a photonic device that includes various components such as an optical coupler, a photodetector, a waveguide structure, a metal-dielectric stack, a contact, an interlayer dielectric layer, and a protection layer.

• The device is designed to be placed over a substrate.
• The optical coupler, photodetector, and waveguide structure are all positioned on top of the substrate.
• The waveguide structure is connected laterally to the optical coupler.
• The top of the waveguide structure is lower than the top of the optical coupler.
• A metal-dielectric stack is placed over the optical coupler, photodetector, and waveguide structure.
• The metal-dielectric stack has a hole positioned above the optical coupler.
• A contact is used to connect the photodetector to the metal-dielectric stack.
• An interlayer dielectric layer is located below the metal-dielectric stack and surrounds the contact.
• A protection layer lines the hole in the metal-dielectric stack.
• The bottom surface of the protection layer is lower than the top surface of the contact.

Original Abstract Submitted

A photonic device includes an optical coupler, a photodetector, a waveguide structure, a metal-dielectric stack, a contact, an interlayer dielectric layer, and a protection layer. The optical coupler, the photodetector, and the waveguide structure are over a substrate. The waveguide structure is laterally connected to the optical couple. A top of the waveguide structure is lower than a top of the optical coupler. The metal-dielectric stack is over the optical coupler, the photodetector, and the waveguide structure. The metal-dielectric stack has a hole above the optical coupler. The contact connects the photodetector to the metal-dielectric stack. The interlayer dielectric layer is below the metal-dielectric stack and surrounds the contact. The protection layer lines the hole of the metal-dielectric stack. A bottom surface of the protection layer is lower than a top surface of the contact.