US Patent Application 18352267. SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD OF MANUFACTURING THE SAME simplified abstract
Contents
SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD OF MANUFACTURING THE SAME
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Jian-Ting Chen of Hsinchu County (TW)
Kuang-Hua Wang of Hsinchu (TW)
SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18352267 titled 'SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The patent application describes a semiconductor package assembly that includes a circuit board, a heat dissipating element, and a semiconductor device.
- The circuit board has a conductive pattern.
- The heat dissipating element is placed on the circuit board and is connected to the conductive pattern.
- The semiconductor device is located on the circuit board and is positioned next to the heat dissipating element.
- The semiconductor device is thermally connected to the heat dissipating element through the conductive pattern.
Original Abstract Submitted
A semiconductor package assembly includes a circuit board, a heat dissipating element and a semiconductor device. The circuit board includes a conductive pattern. The heat dissipating element is located on the circuit board, where the heat dissipating element is connected to the conductive pattern. The semiconductor device is located on the circuit board and next to the heat dissipating element, where the semiconductor device is thermally connected to the heat dissipating element through the conductive pattern.
