US Patent Application 18351809. Fan-Out Package with Controllable Standoff simplified abstract
Contents
Fan-Out Package with Controllable Standoff
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Po-Hao Tsai of Taoyuan City (TW)
Techi Wong of Zhubei City (TW)
Meng-Wei Chou of Zhubei City (TW)
Meng-Liang Lin of Hsinchu (TW)
Fan-Out Package with Controllable Standoff - A simplified explanation of the abstract
This abstract first appeared for US patent application 18351809 titled 'Fan-Out Package with Controllable Standoff
Simplified Explanation
The patent application describes a method for forming an interposer, which involves creating a rigid dielectric layer and removing parts of it.
- The interposer is then bonded to an interconnect structure, along with a package component.
- A spacer in the interposer is in contact with the package component and can be made of a metal feature, the rigid dielectric layer, or a combination of both.
- Finally, a die-saw process is performed on the interconnect structure.
Original Abstract Submitted
A method includes forming an interposer, which includes forming a rigid dielectric layer, and removing portions of the rigid dielectric layer. The method further includes bonding a package component to an interconnect structure, and bonding the interposer to the interconnect structure. A spacer in the interposer has a bottom surface contacting a top surface of the package component, and the spacer includes a feature selected from the group consisting of a metal feature, the rigid dielectric layer, and combinations thereof. A die-saw is performed on the interconnect structure.
