US Patent Application 18350042. DUAL-PORT MEMORY MODULE DESIGN FOR COMPOSABLE COMPUTING simplified abstract

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DUAL-PORT MEMORY MODULE DESIGN FOR COMPOSABLE COMPUTING

Organization Name

HUAWEI TECHNOLOGIES CO., LTD.


Inventor(s)

Jinshui Liu of Plano TX (US)

DUAL-PORT MEMORY MODULE DESIGN FOR COMPOSABLE COMPUTING - A simplified explanation of the abstract

This abstract first appeared for US patent application 18350042 titled 'DUAL-PORT MEMORY MODULE DESIGN FOR COMPOSABLE COMPUTING

Simplified Explanation

The patent application describes a structure and method for implementing a dual-port memory module that improves memory capacity composability, expansion, and sharing.

  • The dual-port memory module uses high-speed SerDes or Optical based redundant access ports to connect to CPUs or compute nodes.
  • Each access port can access part or all of the module's memory capacity based on configuration.
  • This allows for improved memory capacity composability, expansion through memory sharing, and enhanced memory access performance and reliability for composable computing applications.


Original Abstract Submitted

An efficient structure and methodology are provided for implementing a dual-port memory module to provide improved memory capacity composability, expansion and sharing. This dual-port memory module uses high-speed SerDes or Optical based redundant access ports for connection to one or more CPUs or compute nodes, where each access port may access part or all of the module's memory capacity under configuration. This provides improvement for memory capacity composability, expansion through memory sharing and improved memory access performance and reliability for composable computing applications.