US Patent Application 18349491. Fabrication of a Polishing Pad for Chemical Mechanical Polishing simplified abstract
Contents
Fabrication of a Polishing Pad for Chemical Mechanical Polishing
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Ming-Shiuan She of Taoyuan City (TW)
Chun-Hung Liao of Taichung (TW)
Shen-Nan Lee of Hsinchu County (TW)
Teng-Chun Tsai of Hsinchu City (TW)
Fabrication of a Polishing Pad for Chemical Mechanical Polishing - A simplified explanation of the abstract
This abstract first appeared for US patent application 18349491 titled 'Fabrication of a Polishing Pad for Chemical Mechanical Polishing
Simplified Explanation
- The patent application describes a method for forming a polishing pad used in a chemical-mechanical polishing (CMP) process. - The polishing pad is made by forming an interpenetrating polymer network with two phases, where the second phase is embedded in the first phase. - The second phase is then removed, creating a porous top pad with a network of pores embedded in the first phase. - The porous top pad is then adhered to a sub pad to form the final polishing pad. - The interpenetrating polymer network has a periodic pattern and the surface roughness of the porous top pad remains consistent during the polishing process. - The innovation in this patent application lies in the method of forming the polishing pad with a porous top pad, which can potentially improve the efficiency and effectiveness of the CMP process.
Original Abstract Submitted
A method disclosed herein includes forming a polishing pad configured for a chemical-mechanical polishing (CMP) process and polishing a workpiece using the polishing pad and a CMP slurry. Forming the polishing pad includes forming an interpenetrating polymer network having a first phase and a second phase embedded in the first phase, removing the second phase from the interpenetrating polymer network, thereby forming a porous top pad that includes a network of pores embedded in the first phase, and adhering the porous top pad to a sub pad, thereby forming the polishing pad. The second phase is different from the first phase in composition, and the interpenetrating polymer network has a substantially periodic pattern. Surface roughness of the porous top pad is consistent during the polishing of the workpiece.
