US Patent Application 18348460. Fingerprint Sensor in InFO Structure and Formation Method simplified abstract
Contents
Fingerprint Sensor in InFO Structure and Formation Method
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Chih-Hua Chen of Zhubei City (TW)
Fingerprint Sensor in InFO Structure and Formation Method - A simplified explanation of the abstract
This abstract first appeared for US patent application 18348460 titled 'Fingerprint Sensor in InFO Structure and Formation Method
Simplified Explanation
The patent application describes a package that includes a sensor die and an encapsulating material.
- The top surface of the encapsulating material is either at the same level or higher than the top surface of the sensor die.
- The package also includes a plurality of sensing electrodes that are higher than both the sensor die and the encapsulating material.
- These sensing electrodes are arranged in rows and columns and are electrically connected to the sensor die.
- A dielectric layer is used to cover the sensing electrodes.
Original Abstract Submitted
A package includes a sensor die, and an encapsulating material encapsulating the sensor die therein. A top surface of the encapsulating material is substantially coplanar with or higher than a top surface of the sensor die. A plurality of sensing electrodes is higher than the sensor die and the encapsulating material. The plurality of sensing electrodes is arranged as a plurality of rows and columns, and the plurality of sensing electrodes is electrically coupled to the sensor die. A dielectric layer covers the plurality of sensing electrodes.
