US Patent Application 18348396. HEAT SINK AND COMMUNICATION DEVICE simplified abstract
Contents
HEAT SINK AND COMMUNICATION DEVICE
Organization Name
Inventor(s)
HEAT SINK AND COMMUNICATION DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18348396 titled 'HEAT SINK AND COMMUNICATION DEVICE
Simplified Explanation
- The patent application describes a heat sink that includes a substrate, a heat dissipation structure, and a refrigerating medium. - The heat dissipation structure consists of a connection part and a fin part, which are integrated together. - The connection part is connected to the substrate, while the fin part and the connection part are positioned at an angle. - The fin root of the fin part is connected to the connection part, and the fin top is located away from the connection part. - The heat dissipation structure contains a cooling flow channel, with at least a portion of it located in the fin part. - The refrigerating medium flows through the cooling flow channel to dissipate heat from the substrate. - This solution aims to improve the heat conduction capability of the heat sink and enhance heat dissipation reliability.
Original Abstract Submitted
A heat sink is provided, and it includes a substrate, a heat dissipation structure, and a refrigerating medium. The heat dissipation structure includes a connection part and a fin part that are of an integrated structure, the connection part is connected to the substrate, the fin part and the connection part are disposed at an included angle, a fin root of the fin part is connected to the connection part, and a fin top of the fin part is far away from the connection part, a cooling flow channel is disposed in the heat dissipation structure, and at least a part of the cooling flow channel is located in the fin part. The refrigerating medium flows in the cooling flow channel to dissipate heat for the substrate. According to the above solution, a heat conduction capability of the heat sink can be improved, and heat dissipation reliability is good.
