US Patent Application 18347519. INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING SAME simplified abstract
Contents
INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING SAME
Organization Name
Inventor(s)
Ungcheon Kim of Cheonan-si (KR)
Sungwoo Park of Seongnam-si (KR)
Yukyung Park of Hwaseong-si (KR)
Seungkwan Ryu of Seongnam-si (KR)
INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING SAME - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18347519 Titled 'INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING SAME'
Simplified Explanation
The abstract describes an interposer, which is a component used in electronic devices. The interposer consists of several layers, including a base layer, a redistribution structure with a conductive pattern, lower protection layers, a lower conductive pad, and a through electrode. The interposer also has an indentation in its outer edge region, which creates a continuous angled sidewall that goes through the protection layers. The purpose of this interposer is not explicitly mentioned in the abstract.
Original Abstract Submitted
An interposer including a base layer, a redistribution structure on a first surface of the base layer and including a conductive redistribution pattern, a first lower protection layer on a second surface of the base layer, a lower conductive pad on the first lower protection layer, a through electrode connecting the conductive redistribution pattern and the lower conductive pad, a second lower protection layer on the first lower protection layer, including a different material than the first lower protection layer, and contacting at least a portion of the lower conductive pad, and an indentation formed in an outer edge region of the interposer to provide a continuous angled sidewall extending entirely through the second lower protection layer and through at least a portion of the first protection layer.
