US Patent Application 18343783. BOARD-LEVEL STRUCTURE AND COMMUNICATION DEVICE simplified abstract
Contents
BOARD-LEVEL STRUCTURE AND COMMUNICATION DEVICE
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Inventor(s)
BOARD-LEVEL STRUCTURE AND COMMUNICATION DEVICE - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18343783 Titled 'BOARD-LEVEL STRUCTURE AND COMMUNICATION DEVICE'
Simplified Explanation
This abstract describes a technology related to a board-level structure. The structure consists of an upper-layer substrate, a lower-layer substrate, and several support members placed between them. There is a gap between the upper and lower substrates, which is divided into two regions: a first gap region and a second gap region. These regions are separated by a spaced region that does not include either of the gap regions. The maximum vertical distance between the upper and lower substrates in the first gap region is smaller than the minimum vertical distance in the second gap region.
Original Abstract Submitted
The technology of this application relates to a board-level structure that includes an upper-layer substrate, a lower-layer substrate, and a plurality of support members that can be supported between the upper-layer substrate and the lower-layer substrate. In an example embodiment, a gap exists between the upper-layer substrate and the lower-layer substrate, the gap includes at least one first gap region and at least one second gap region, the first gap region and the second gap region are spaced, a spaced region between the first gap region and the second gap region does not include the first gap region or the second gap region, and a maximum vertical distance between the upper-layer substrate and the lower-layer substrate in the first gap region is less than a minimum vertical distance between the upper-layer substrate and the lower-layer substrate in the second gap region.
