US Patent Application 18341788. THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORMING THE SAME simplified abstract
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORMING THE SAME
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chung-Yu Lu of Hsinchu City (TW)
Ping-Kang Huang of Chiayi City (TW)
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORMING THE SAME - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18341788 Titled 'THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORMING THE SAME'
Simplified Explanation
The abstract describes a technology related to board substrates and three-dimensional integrated circuit structures. It mentions the components of a board substrate, including a core layer, two build-up layers, two groups of bumps, and at least one underfill blocking wall. The build-up layers are located on opposite sides of the core layer, and the bumps are placed on top of the first build-up layer. The underfill blocking wall is positioned between the two groups of bumps.
Original Abstract Submitted
Board substrates, three-dimensional integrated circuit structures and methods of forming the same are disclosed. A board substrate includes a core layer, a first build-up layer, a second build-up layer, a first group of bumps, a second first group of bumps and at least one first underfill blocking wall. The first build-up layer and the second build-up layer are disposed on opposite sides of the core layer. The first group of bumps is disposed over the first build-up layer. The second first group of bumps is disposed over the first build-up layer. The at least one first underfill blocking wall is disposed over the first build-up layer and between the first group of bumps and the second group of bumps.
