US Patent Application 18341088. MEMORY CIRCUIT AND CACHE CIRCUIT CONFIGURATION simplified abstract
Contents
MEMORY CIRCUIT AND CACHE CIRCUIT CONFIGURATION
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Hsien-Hsin Sean Lee of Duluth GA (US)
William Wu Shen of Hsinchu City (TW)
Yun-Han Lee of Hsinchu County (TW)
MEMORY CIRCUIT AND CACHE CIRCUIT CONFIGURATION - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18341088 Titled 'MEMORY CIRCUIT AND CACHE CIRCUIT CONFIGURATION'
Simplified Explanation
The abstract describes a memory system that consists of multiple groups of primary memory cells and cache memory cells. These memory cells are located in different dies (chips). The primary memory cells are in the first die or a stack of first dies, while the cache memory cells are in the second die. An interposer is used to connect the first and second dies, and control circuits are present in a third die. Each group of cache memory cells corresponds to a group of primary memory cells. The first die is connected to the top surface of the second die, the second die is connected to the top surface of the interposer, and the third die is positioned next to the second die and connected to the top surface of the interposer.
Original Abstract Submitted
A memory system includes multiple groups of primary memory cells residing in a first die or a stack of first dies, multiple groups of cache memory cells residing in a second die, an interposer, and control circuits residing in a third die. Each group of the cache memory cells is associated with a corresponding group of the primary memory cells. The first die or the stack of first dies is coupled to a top surface of the second die through a first group of bumps. A bottom surface of the second die is coupled to a top surface of the interposer through a second group of bumps. The control circuits are associated with the primary memory cells and the cache memory cells. The third die is positioned aside the second die and coupled to the top surface of the interposer through a third group of pumps.
