US Patent Application 18340681. CHIP-ON-FILM PACKAGE, DISPLAY MODULE INCLUDING SAME, AND ELECTRONIC DEVICE INCLUDING SAME simplified abstract
Contents
CHIP-ON-FILM PACKAGE, DISPLAY MODULE INCLUDING SAME, AND ELECTRONIC DEVICE INCLUDING SAME
Organization Name
Inventor(s)
Jeongkyu Ha of Hwaseong-si (KR)
CHIP-ON-FILM PACKAGE, DISPLAY MODULE INCLUDING SAME, AND ELECTRONIC DEVICE INCLUDING SAME - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18340681 Titled 'CHIP-ON-FILM PACKAGE, DISPLAY MODULE INCLUDING SAME, AND ELECTRONIC DEVICE INCLUDING SAME'
Simplified Explanation
The abstract describes a chip-on-film (COF) package, which is a type of electronic packaging used for mounting chips onto a flexible film. The package consists of a film with different areas - a reinforcement area, a bending area, and a chip mounting area. The film has a conductive pattern layer on it, which is used for connecting the chip. The chip is mounted on the conductive pattern layer in the chip mounting area. The package also includes two insulating layers - a first layer with a higher elastic modulus in the reinforcement area and a second layer with a lower elastic modulus in the bending area. This means that the first layer is stiffer and more rigid, while the second layer is more flexible. The film remains intact in the chip mounting area, meaning it is not damaged or broken.
Original Abstract Submitted
A chip-on-film (COF) package includes a film including a reinforcement area, a bending area and a chip mounting area, a conductive pattern layer disposed on the film in the reinforcement area and in the bending area, and at least partially in the chip mounting area, a chip mounted on a portion of the conductive pattern layer in the chip mounting area, a first insulating layer having a first elastic modulus and extending over the conductive pattern layer in the reinforcement area, and a second insulating layer having a second elastic modulus and extending over the conductive pattern layer in the bending area, wherein the first elastic modulus is greater than the second elastic modulus, and the film is intact in the chip mounting area.
