US Patent Application 18337202. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
Contents
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Taeyeong Kim of Yongin-si (KR)
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18337202 Titled 'METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE'
Simplified Explanation
This abstract describes a method for bonding two substrates together using bonding chucks. The first substrate is fixed to the first bonding chuck and the second substrate is fixed to the second bonding chuck. The two chucks are then aligned and the substrates are bonded together. During the bonding process, a process gas is injected between the substrates using a process gas injector, and an air curtain forming gas is used to create an air curtain around the substrates. This method combines the use of the process gas injector and the air curtain generator to facilitate the bonding process.
Original Abstract Submitted
A bonding method for bonding a first substrate to a second substrate includes fixing the first substrate to a first surface of a first bonding chuck and fixing the second substrate to a second surface of a second bonding chuck, the second surface facing the first surface; aligning the second bonding chuck above the first bonding chuck in a vertical direction or in a horizontal direction; bonding the first substrate to the second substrate to make a bonded substrate; and wherein, in the bonding the first substrate to the second substrate, injecting a process gas between the first substrate and the second substrate using a process gas injector surrounding at least one selected from the first bonding chuck and the second bonding chuck in a plan view and injecting an air curtain forming gas to form an air curtain surrounding the first substrate and the second substrate using an air curtain generator are performed in combination.
