US Patent Application 18337019. SEMICONDUCTOR PACKAGE WITH ANTENNA AND METHOD OF FORMING THE SAME simplified abstract

SEMICONDUCTOR PACKAGE WITH ANTENNA AND METHOD OF FORMING THE SAME

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Wen-Shiang Liao of Miaoli County (TW)

SEMICONDUCTOR PACKAGE WITH ANTENNA AND METHOD OF FORMING THE SAME - A simplified explanation of the abstract

• This abstract for appeared for US patent application number 18337019 Titled 'SEMICONDUCTOR PACKAGE WITH ANTENNA AND METHOD OF FORMING THE SAME'

Simplified Explanation

This abstract describes a semiconductor package that consists of a semiconductor die, an encapsulation layer, and at least one antenna structure. The encapsulation layer surrounds the semiconductor die from the sides. The antenna structure is embedded within the encapsulation layer next to the semiconductor die. The antenna structure includes a dielectric bulk, which has a higher dielectric constant compared to the encapsulation layer.

Original Abstract Submitted

A semiconductor package includes a semiconductor die, an encapsulation layer and at least one antenna structure. The encapsulation layer laterally encapsulates the semiconductor die. The at least one antenna structure is embedded in the encapsulation layer aside the semiconductor die. The at least one antenna structure includes a dielectric bulk, and a dielectric constant of the dielectric bulk is higher than a dielectric constant of the encapsulation layer.