US Patent Application 18336516. PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT simplified abstract
Contents
PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chih-Chiang Tsao of Taoyuan City (TW)
Wei-Yu Chen of Taipei City (TW)
Hsiu-Jen Lin of Zhubei City (TW)
Ming-Da Cheng of Taoyuan City (TW)
Ching-Hua Hsieh of Hsinchu (TW)
Chung-Shi Liu of Hsinchu City (TW)
PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18336516 Titled 'PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT'
Simplified Explanation
The abstract describes a package structure that consists of a semiconductor chip and a protective layer that surrounds the chip. Additionally, there is a polymer-containing element placed over the protective layer. It is worth noting that the protective layer is wider than the polymer-containing element.
Original Abstract Submitted
A package structure is provided. The package structure includes a semiconductor chip and a protective layer laterally surrounding the semiconductor chip. The package structure also includes a polymer-containing element over the protective layer. The protective layer is wider than the polymer-containing element.
