US Patent Application 18336435. PACKAGE STRUCTURE WITH DUMMY DIE simplified abstract

PACKAGE STRUCTURE WITH DUMMY DIE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Hsien-Wei Chen of Hsinchu City (TW)

Li-Hsien Huang of Zhubei City (TW)

PACKAGE STRUCTURE WITH DUMMY DIE - A simplified explanation of the abstract

• This abstract for appeared for US patent application number 18336435 Titled 'PACKAGE STRUCTURE WITH DUMMY DIE'

Simplified Explanation

The abstract describes a package structure and a method for creating it. The structure consists of a package component, a dummy die placed on top of the package component, and a device die next to the dummy die. A buffer layer is formed beneath the dummy die, with one surface in direct contact with the bottom surface of the dummy die and the other surface separated from the package component. The package structure is completed by a package layer that surrounds the device die, dummy die, and buffer layer.

Original Abstract Submitted

A package structure and method for forming the same are provided. The package structure includes a package component, and a dummy die disposed over the package component. The package structure includes a device die adjacent to the dummy die, and a buffer layer formed below the dummy die. The buffer layer has a first surface and an opposite second surface, the first surface is in direct contact with a bottom surface of the dummy die and the second surface is separated from the package component. The package structure includes a package layer surrounding the device die, the dummy die and the buffer layer.