US Patent Application 18336303. SEMICONDUCTOR PACKAGE WITH RIVETING STRUCTURE BETWEEN TWO RINGS AND METHOD FOR FORMING THE SAME simplified abstract
Contents
SEMICONDUCTOR PACKAGE WITH RIVETING STRUCTURE BETWEEN TWO RINGS AND METHOD FOR FORMING THE SAME
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Chien Hung Chen of Taipei (TW)
Shu-Shen Yeh of Taoyuan City (TW)
Po-Yao Lin of Zhudong Township (TW)
SEMICONDUCTOR PACKAGE WITH RIVETING STRUCTURE BETWEEN TWO RINGS AND METHOD FOR FORMING THE SAME - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18336303 Titled 'SEMICONDUCTOR PACKAGE WITH RIVETING STRUCTURE BETWEEN TWO RINGS AND METHOD FOR FORMING THE SAME'
Simplified Explanation
This abstract describes a semiconductor package and a method of creating it. The package includes a substrate and a semiconductor device mounted on the substrate. There are two rings, with the first one surrounding the semiconductor device and the second one placed on top of the first ring. The first ring has a protruding part on its top surface, and the second ring has a matching recessed part on its bottom surface. These parts connect the two rings together. An adhesive layer is used to attach the rings to the substrate.
Original Abstract Submitted
A semiconductor package and a method of forming the same are provided. The semiconductor package includes a package substrate and a semiconductor device mounted on the surface of the package substrate. A first ring is disposed over the surface of the package substrate and surrounds the semiconductor device. A second ring is disposed over the top surface of the first ring. Also, a protruding part and a matching recessed part are formed on the top surface of the first ring and the bottom surface of the second ring, respectively. The protruding part extends into and engages with the recessed part to connect the first ring and the second ring. An adhesive layer is disposed between the surface of the package substrate and the bottom surface of the first ring for attaching the first ring and the overlying second ring to the package substrate.
