US Patent Application 18336059. ARRAY TYPE CONNECTION STRUCTURE AND ELECTRONIC DEVICE simplified abstract
Contents
ARRAY TYPE CONNECTION STRUCTURE AND ELECTRONIC DEVICE
Organization Name
Inventor(s)
Yinzhong Tang of Dongguan (CN)
ARRAY TYPE CONNECTION STRUCTURE AND ELECTRONIC DEVICE - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18336059 Titled 'ARRAY TYPE CONNECTION STRUCTURE AND ELECTRONIC DEVICE'
Simplified Explanation
The abstract describes a new type of connection structure called an array type connection structure. This structure includes a support and connecting assemblies. The support does not have any signal cable routing. Each connecting assembly goes through the support and has a connector interface on one side, which has multiple signal terminals. This connector interface can be connected to a first electronic component on one side of the support. On the other side of each connecting assembly, there are multiple cables directly connected. These cables correspond one-to-one with the signal terminals of the connecting assembly and can be connected to a second electronic component on the other side of the support. The support also has a heat dissipation through hole, which is partially located between two adjacent connecting assemblies.
Original Abstract Submitted
An array type connection structure is disclosed. The structure includes a support and connecting assemblies. There is no signal cable routing in the support. Each connecting assembly penetrates through the support; a first side of each connecting assembly has a connector interface including a plurality of first signal terminals, and the connector interface is configured to be connected to a first electronic component located on a first side of the support. A second side of each connecting assembly is directly connected to a plurality of cables, the plurality of cables are in a one-to-one correspondence with the plurality of second signal terminals of the connecting assembly, and the cable is configured to be connected to a second electronic component located on a second side of the support. The support is provided with a heat dissipation through hole, which is at least partially located between two adjacent connecting assemblies.
