US Patent Application 18335413. DAISY-CHAIN SEAL RING STRUCTURE simplified abstract
Contents
DAISY-CHAIN SEAL RING STRUCTURE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chun-Liang Lu of Tainan City (TW)
Chun-Wei Chia of Kaohsiung City (TW)
Chun-Hao Chou of Tainan City (TW)
Kuo-Cheng Lee of Tainan City (TW)
DAISY-CHAIN SEAL RING STRUCTURE - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18335413 Titled 'DAISY-CHAIN SEAL RING STRUCTURE'
Simplified Explanation
This abstract describes a semiconductor device that consists of two wafers. The device includes a seal ring structure, which is made up of three metal structures embedded in the bodies of the wafers. The first wafer has a first metal structure and a second metal structure, while the second wafer has a third metal structure. The device also includes a metal bonding structure that connects these metal structures. This bonding structure consists of a first set of metal elements that connect the first metal structure of the first wafer with the third metal structure of the second wafer, and a second set of metal elements that connect the second metal structure of the first wafer with the third metal structure of the second wafer.
Original Abstract Submitted
A semiconductor device includes a first wafer and a second wafer. The semiconductor device includes a seal ring structure comprising a first metal structure in a body of the first wafer, a second metal structure in the body of the first wafer, a third metal structure in a body of the second wafer, and a metal bonding structure including a first set of metal elements coupling the first metal structure and the third metal structure through an interface between the first wafer and the second wafer, and a second set of metal elements coupling the second metal structure and the third metal structure through the interface between the first wafer and the second wafer.
