US Patent Application 18335387. RESIN COMPOSITION, ADHESIVE MEMBER, AND DISPLAY DEVICE simplified abstract

RESIN COMPOSITION, ADHESIVE MEMBER, AND DISPLAY DEVICE

Inventors

Katsuhiro Yamamoto of Yokohama (JP)

RESIN COMPOSITION, ADHESIVE MEMBER, AND DISPLAY DEVICE - A simplified explanation of the abstract

• This abstract for appeared for patent application number 18335387 Titled 'RESIN COMPOSITION, ADHESIVE MEMBER, AND DISPLAY DEVICE'

Simplified Explanation

The abstract describes a resin composition that has specific viscosity and storage modulus properties at different temperatures. The viscosity of the resin is equal to or less than 20 mPa·s at a temperature between 30°C and 50°C. The storage modulus of the resin is between 1.7×10Pa and 3×10Pa at -20°C, and between 1.5×10Pa and 6×10Pa at 25°C. The abstract also mentions the provision of an adhesive member made from this resin composition.

Original Abstract Submitted

A resin composition has a viscosity of equal to or less than about 20 mPa·s at a temperature in a range of about 30° C. to about 50° C. as measured according to JIS Z8803, a storage modulus in a range of about 1.7×10Pa to about 3×10Pa at about −20° C., and a storage modulus in a range of about 1.5×10Pa to about 6×10Pa at about 25° C. An adhesive member formed of the resin composition is also provided.