US Patent Application 18335232. PELLICLE FRAME WITH STRESS RELIEF TRENCHES simplified abstract
Contents
PELLICLE FRAME WITH STRESS RELIEF TRENCHES
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
You-Cheng Jhang of Changhua (TW)
Jui-Chun Weng of Taipei City (TW)
Chiu-Hua Chung of Hsinchu City (TW)
Sheng-Yuan Lin of Hsinchu (TW)
Hsin-Yu Chen of Hsinchu City (TW)
PELLICLE FRAME WITH STRESS RELIEF TRENCHES - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18335232 Titled 'PELLICLE FRAME WITH STRESS RELIEF TRENCHES'
Simplified Explanation
The abstract describes a method of forming a photomask assembly with stress relief trenches in the pellicle frame. These trenches help to prevent damage to the pellicle by allowing the frame to deform along with the pellicle, reducing the amount of damage caused by the frame.
Original Abstract Submitted
A photomask assembly may be formed such that stress relief trenches are formed in a pellicle frame of the photomask assembly. The stress relief trenches may reduce or prevent damage to a pellicle that may otherwise result from deformation of the pellicle. The stress relief trenches may be formed in areas of the pellicle frame to allow the pellicle frame to deform with the pellicle, thereby reducing the amount damage to the pellicle caused by the pellicle frame.
