US Patent Application 18334843. Semiconductor Device and Method of Manufacture simplified abstract
Contents
Semiconductor Device and Method of Manufacture
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Chien-Hsun Chen of Zhutian Township (TW)
Semiconductor Device and Method of Manufacture - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18334843 Titled 'Semiconductor Device and Method of Manufacture'
Simplified Explanation
The abstract describes a method for assembling electronic components on a carrier. The method involves creating a redistribution structure on the carrier and then attaching an integrated passive device to one side of the redistribution structure. An interconnect structure is also attached to the same side of the redistribution structure, with the integrated passive device placed between them. An underfill material is deposited between the interconnect structure and the redistribution structure. Finally, a semiconductor device is attached to the other side of the redistribution structure.
Original Abstract Submitted
A method includes forming a redistribution structure on a carrier, attaching an integrated passive device on a first side of the redistribution structure, attaching an interconnect structure to the first side of the redistribution structure, the integrated passive device interposed between the redistribution structure and the interconnect structure, depositing an underfill material between the interconnect structure and the redistribution structure, and attaching a semiconductor device on a second side of the redistribution structure that is opposite the first side of the redistribution structure.
