US Patent Application 18334552. ELECTROLYTIC COPPER FOIL AND PREPARATION METHOD THEREFOR, NEGATIVE ELECTRODE PLATE, SECONDARY BATTERY, BATTERY MODULE, BATTERY PACK AND POWER CONSUMING DEVICE simplified abstract
Contents
- 1 ELECTROLYTIC COPPER FOIL AND PREPARATION METHOD THEREFOR, NEGATIVE ELECTRODE PLATE, SECONDARY BATTERY, BATTERY MODULE, BATTERY PACK AND POWER CONSUMING DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ELECTROLYTIC COPPER FOIL AND PREPARATION METHOD THEREFOR, NEGATIVE ELECTRODE PLATE, SECONDARY BATTERY, BATTERY MODULE, BATTERY PACK AND POWER CONSUMING DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Original Abstract Submitted
ELECTROLYTIC COPPER FOIL AND PREPARATION METHOD THEREFOR, NEGATIVE ELECTRODE PLATE, SECONDARY BATTERY, BATTERY MODULE, BATTERY PACK AND POWER CONSUMING DEVICE
Organization Name
CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED
Inventor(s)
ELECTROLYTIC COPPER FOIL AND PREPARATION METHOD THEREFOR, NEGATIVE ELECTRODE PLATE, SECONDARY BATTERY, BATTERY MODULE, BATTERY PACK AND POWER CONSUMING DEVICE - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18334552 Titled 'ELECTROLYTIC COPPER FOIL AND PREPARATION METHOD THEREFOR, NEGATIVE ELECTRODE PLATE, SECONDARY BATTERY, BATTERY MODULE, BATTERY PACK AND POWER CONSUMING DEVICE'
Simplified Explanation
The abstract describes a method for preparing an electrolytic copper foil. This method involves placing an anode and a cathode in an electroplating tank filled with a twin crystal growth agent and an electroplating solution. The electroplating solution undergoes alternating transitions of ultrasonic waves at different frequencies. Direct current electroplating is then performed to produce the electrolytic copper foil. The specific frequencies used in the process are f11, f12, f21, and f22, with f11 being greater than 40 kHz, f12 ranging from 15 kHz to 40 kHz, f21 ranging from 0 kHz to 15 kHz, and f22 being 0 kHz.
Original Abstract Submitted
A method for preparing an electrolytic copper foil includes placing an anode and a cathode to be plated in a twin crystal growth agent containing electroplating solution in an electroplating tank, and, under conditions that the electroplating solution is provided with randomly alternating transitions of one or two of an ultrasonic wave at a frequency f11 and an ultrasonic wave at a frequency f12 and one or two of an ultrasonic wave at a frequency f21 and an ultrasonic wave at a frequency f22, performing direct current electroplating to obtain the electrolytic copper foil, wherein f11>40 kHz, 15 kHz<f12≤40 kHz, 0 kHz<f21≤15 kHz, and f22=0 kHz.
