US Patent Application 18334526. Chemical Mechanical Planarization Tool simplified abstract
Contents
Chemical Mechanical Planarization Tool
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Tung-Kai Chen of New Taipei City (TW)
Shang-Yu Wang of Changhua County (TW)
Chemical Mechanical Planarization Tool - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18334526 Titled 'Chemical Mechanical Planarization Tool'
Simplified Explanation
The abstract describes a method for operating a chemical mechanical planarization (CMP) tool. The method involves attaching a polishing pad to a platen using glue, and then removing the pad, leaving residue from the glue on the platen. The residue is identified using a fluorescent material, and then removed from the platen.
Original Abstract Submitted
A method of operating a chemical mechanical planarization (CMP) tool includes attaching a polishing pad to a first surface of a platen of the CMP tool using a glue; removing the polishing pad from the platen, wherein after removing the polishing pad, residue portions of the glue remain on the first surface of the platen; identifying locations of the residue portions of the glue on the first surface of the platen using a fluorescent material; and removing the residue portions of the glue from the first surface of the platen.
