US Patent Application 18334390. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract

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PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.


Inventor(s)

Po-Yao Lin of Hsinchu County (TW)


Shu-Shen Yeh of Taoyuan City (TW)


Chin-Hua Wang of New Taipei City (TW)


Yu-Sheng Lin of Hsinchu County (TW)


Shin-Puu Jeng of Hsinchu (TW)


PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME - A simplified explanation of the abstract

  • This abstract for appeared for US patent application number 18334390 Titled 'PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME'

Simplified Explanation

The abstract describes a package structure and a method of creating it. The structure consists of three tiers: the first tier has an interposer, the second tier has a bottom die, and the third tier has multiple first dies and at least one second die. The second die is positioned between the first dies. The first dies are connected to the bottom die through first connectors to create a signal path, and they are connected to the interposer through second connectors to create a power path. The first connectors are closer to the second die than the second connectors.


Original Abstract Submitted

Provided are a package structure and a method of forming the same. The package structure includes a first tier, a second tier, and a third tier. The first tier includes an interposer. The second tier is disposed on the first tier and includes a bottom die. The third tier is disposed on the second tier and includes a plurality of first dies and at least one second die. The at least one second die is disposed between the plurality of first dies. The plurality of first dies are electrically connected to the bottom die by a plurality of first connectors to form a signal path, the plurality of first dies are electrically connected to the interposer by a plurality of second connectors to form a power path, and the plurality of first connectors are closer to the at least one second die than the plurality of second connectors.

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